Electronic device

ABSTRACT

An electronic device is provided, which includes a first substrate, a second substrate, a first spacer, and a second spacer. The first spacer is on the first substrate, and the second spacer is on the second substrate and between the first spacer and the second substrate. Part of the first spacer is not overlapped with the second spacer, and the first spacer includes a first portion, a second portion, and a third portion. The first portion overlaps with the second spacer in a normal direction of the first substrate. The first portion connects between the second portion and the third portion. The first portion has a first length, the second portion has a second length, and the third portion has a third length. The second length is greater than or equal to the first length, and the third length is greater than or equal to the first length.

BACKGROUND Technical Field

The present disclosure relates to an electronic device, and inparticular it relates to an electronic device with a spacer.

Description of the Related Art

Electronic products equipped with display panels have becomeindispensable necessities in modem society. With the flourishingdevelopment of these portable electronic products, consumers have highexpectations regarding their quality, functionality, and price.

Electronic products, such as smartphones, tablet computers, notebookcomputers, displays, and televisions, have become indispensable productsin daily life. The electronic products (such as displays) have not yetmet consumer expectations in various aspects (such as quality andfunction). For example, the panels in electronic products have spacers.When the panel is subjected to external forces, the spacers may shift oraffect the layer (such as the alignment layer) disposed on the oppositesubstrate, thereby affecting its quality or performance. Therefore, thedevelopment of a design that can improve the above problems is still oneof the topics that the industry is devoted to research.

SUMMARY

In accordance with some embodiments of the present disclosure, anelectronic device is provided. The electronic device includes a firstsubstrate, a second substrate, a first spacer, and a second spacer. Thesecond substrate is disposed opposite to the first substrate, the firstspacer is disposed on the first substrate, and the second spacer isdisposed on the second substrate and between the first spacer and thesecond substrate. Part of the first spacer is not overlapped with thesecond spacer. The first spacer includes a first portion, a secondportion and a third portion. The first portion overlaps with the secondspacer in a normal direction of the first substrate. The first portionconnects between the second portion and the third portion. The firstportion has a first length, the second portion has a second length, andthe third portion has a third length. The second length is greater thanor equal to the first length, and the third length is greater than orequal to the first length.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is a schematic partial top-view diagram of an electronic devicein accordance with some embodiments of the present disclosure;

FIG. 2 is a schematic partial top-view diagram of an electronic devicein accordance with some embodiments of the present disclosure;

FIG. 3 is a schematic cross-sectional diagram of an electronic devicetaken along section line C-C′ in the embodiment of FIG. 1 of the presentdisclosure;

FIG. 4 is a schematic top-view diagram of an electronic device inaccordance with some embodiments of the present disclosure;

FIG. 5 is a schematic top-view diagram of an electronic device inaccordance with some embodiments of the present disclosure;

FIG. 6 is a schematic cross-sectional diagram of an electronic device inaccordance with some embodiments of the present disclosure;

FIG. 7 is a schematic top-view diagram of some elements of an electronicdevice in accordance with some embodiments of the present disclosure;

FIG. 8 is a schematic top-view diagram of some elements of an electronicdevice in accordance with some embodiments of the present disclosure;

FIG. 9 is a schematic top-view diagram of some elements of an electronicdevice in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The electronic device of the present disclosure is described in detailin the following description. It should be understood that in thefollowing detailed description, for purposes of explanation, numerousspecific details and embodiments are set forth in order to provide athorough understanding of the present disclosure. The elements andconfigurations described in the following detailed description are setforth in order to clearly describe the present disclosure. Theembodiments are used merely for the purpose of illustration. Inaddition, the drawings of different embodiments may use like and/orcorresponding numerals to denote like and/or corresponding elements inorder to clearly describe the present disclosure. However, the use oflike and/or corresponding numerals in the drawings of differentembodiments does not suggest any correlation between differentembodiments.

The present disclosure can be understood by referring to the followingdetailed description in connection with the accompanying drawings. Itshould be noted that, in order to allow the reader to easily understandthe drawings, several drawings in the present disclosure only depict aportion of the electronic device, and the specific elements in thedrawings are not drawn to scale. In addition, the number and size ofeach element in the drawings are only for illustration, and are notlimited the scope of the present disclosure.

Throughout the present disclosure and the appended claims, certain termsare used to refer to specific elements. Those skilled in the art shouldunderstand that electronic device manufacturers may refer to the sameelement with different names. The present disclosure does not intend todistinguish between elements that have the same function but differentnames. In the specification and claims, the terms “comprising”,“including”, “having” and the like are open-ended phrases, so theyshould be interpreted as “including but is not limited to . . . ”.Therefore, when the terms “comprising”, “including” and/or “having” areused in the description of the present disclosure, they specify thecorresponding features, regions, steps, operations and/or components,but do not exclude the existence of one or more corresponding features,regions, steps, operations and/or components.

Directional terms mentioned in the present disclosure, such as “upper”,“lower”, “front”, “rear”, “left”, “right”, etc., are only the directionsreferring to the drawings. Therefore, the directional terms are used forillustration, not for limiting the present disclosure. In the drawings,each drawing depicts general features of methods, structures, and/ormaterials used in particular embodiments. However, these drawings shouldnot be interpreted as defining or limiting the scope or propertyencompassed by these embodiments. For example, for clarity, the relativesizes, thicknesses, and positions of the various layers, regions, and/orstructures may be reduced or enlarged.

When a corresponding component (such as a layer or region) is referredto as “(disposed or located) on another component”, it may be directly(disposed or located) on another component, or there may be othercomponents between them. On the other hand, when a component is referredto as “directly (disposed or located) on another component”, there is nocomponent existing between them. In addition, when a component isreferred to as “(disposed or located) on another component”, the twohave an upper-lower relationship in a top-view direction, and thiscomponent may be above or below another component, and the upper-lowerrelationship depends on the orientation of the device.

The terms “about”, “equal to”, “the same as”, “identical to”,“substantially” or “approximately” are generally interpreted as beingwithin 20% of a given value or range, or within 10%, 5%, 3%, 2%, 1% or0.5% of the given value or range.

The ordinal numbers used in the specification and claims, such as theterms “first”, “second”, etc., are used to modify an element, whichitself does not mean and represent that the element (or elements) hasany previous ordinal number, and does not mean the order of a certainelement and another element, or the order in the manufacturing method.The use of these ordinal numbers is used to make a component with acertain name can be clearly distinguished from another component withthe same name. The same words may not be used in the claims and thespecification. Accordingly, the first component in the specification maybe the second component in the claims.

It should be noted that the following embodiments can replace,recombine, and mix features in several different embodiments to completeother embodiments without departing from the spirit of the presentdisclosure. The features between the various embodiments can be mixedand used arbitrarily as long as they do not violate or conflict thespirit of the present disclosure.

In the present disclosure, the length and the width of the component canbe measured from an optical microscope image, and the thickness of thecomponent can be measured from a cross-sectional image in an electronmicroscope, but it is not limited thereto. In addition, certain errorsmay exist between any two values or directions used for comparison. Ifthe first value is equal to the second value, it implies that there maybe an 10% error between the first value and the second value; if thefirst direction is perpendicular to the second direction, the anglebetween the first direction and the second direction may be between 80degrees and 100 degrees; if the first direction is parallel to thesecond direction, the angle between the first direction and the seconddirection may be between 0 degrees and 10 degrees.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this disclosure belongs. It should be appreciated that,in each case, the term, which is defined in a commonly used dictionary,should be interpreted as having a meaning that conforms to the relativeskills of the present disclosure and the background or the context ofthe present disclosure, and should not be interpreted in an idealized oroverly formal manner unless so defined.

In accordance with some embodiments of the present disclosure, theprovided electronic device includes spacers with a large buffer spacefor displacement. In detail, for example, spacers (such as the firstspacer and the second spacer as follows) are disposed on the twosubstrates respectively, and these spacers may contact or intersect eachother, and these spacers respectively have part that overlaps with theopposite spacer and other parts that do not overlap with the oppositespacers. In addition, the area (or length) of the non-overlapping part(or portion) may be greater than or equal to the area (or length) of theoverlapping part (or portion). When the panel is subjected to externalforce, the above design can reduce the slippage of the spacers due todisplacement, which affecting other layers (for example, alignmentlayer, but it is not limited thereto) on the opposite substrate. Forexample, when the spacer shifts and slips, and scratches the alignmentlayer disposed on the opposite substrate, or uneven alignment may occur.

In accordance with some embodiments of the present disclosure, theelectronic device may include a display device, a light-emitting device,a touch device, a sensing device, an antenna device or a tiled device (atiled device having any of the above functions or a hybrid function),but it is not limited thereto. The electronic device may include abendable electronic device or a flexible electronic device, but it isnot limited thereto. For example, the electronic device may include,liquid-crystal, light-emitting diode (LED), quantum dot (QD),fluorescence, phosphor, other suitable materials or a combinationthereof. For example, the light-emitting diode may include organiclight-emitting diode (OLED), micro-LED, micro-LED, mini-LED or quantumdot light-emitting diode (QLED, QDLED), but it is not limited thereto.In some embodiments, the electronic device may include a panel and/or abacklight module. The panel includes a liquid-crystal panel, but it isnot limited thereto. It should be understood that the liquid-crystaldisplay device will be taken as an example to illustrate the disclosedelectronic device, but it is not limited thereto.

Refer to FIG. 1, FIG. 2 and FIG. 3, FIG. 1 is a schematic partialtop-view diagram of an electronic device 10 in accordance with someembodiments of the present disclosure. FIG. 2 is a schematic partialtop-view diagram of the electronic device 10 in accordance with someembodiments of the present disclosure. FIG. 3 is a schematiccross-sectional diagram of the electronic device 10 taken along segmentline C-C′ in the embodiment of FIG. 1. It should be understood that,some elements in the electronic device 10 are omitted in FIG. 1, FIG. 2,and FIG. 3, and only some elements formed or disposed on the firstsubstrate 100 or the second substrate 200 are schematically shown forclarity. In accordance with some embodiments, additional features orelements may be added to the electronic device 10. In some embodiments,some features of the electronic device 10 described below may beoptionally replaced or omitted.

Referring to FIG. 1, FIG. 2, and FIG. 3, the electronic device 10includes a first substrate 100, a second substrate 200, a first spacer102 and a second spacer 202. In some embodiments (also refer to FIG. 6),the second substrate 200 is disposed opposite to the first substrate100, the first spacer 102 is disposed on the first substrate 100, andthe second spacer 202 is disposed on the second substrate 200 andbetween the first spacer 102 and the second substrate 200. In someembodiments, the materials of the first substrate 100 and/or the secondsubstrate 200 may include, but is not limited to, glass, quartz,sapphire, ceramic, polyimide (PI), polycarbonate (PC), photosensitivepolyimide (PSPI), polyethylene terephthalate (PET), other suitablematerials or a combination thereof.

Referring to FIG. 1, in some embodiments, the first substrate 100 can beused as a driving substrate (or an array substrate), but it is notlimited thereto. In some embodiments, the electronic device 10 mayinclude a driving circuit (not illustrated) disposed on the firstsubstrate 100. The driving circuit may include an active driving circuitor a passive driving circuit. In some embodiments, the electronic device10 includes a plurality of data lines DL and a plurality of scan linesSL (e.g., indicated by bold dotted lines) disposed on the firstsubstrate 100. The data lines DL and the scan lines SL are intersectedto define a plurality of pixel units (e.g., sub-pixels, notillustrated), these pixel units have transistors 100T, whichrespectively includes, but is not limited to, switching transistors ordriving transistors. Refer to FIG. 1, in some embodiments, thetransistor 100T includes a semiconductor layer 104 (thin dotted line), asource electrode SE (e.g., a part of the data line DL, and the sourceelectrode SE may at least overlap with the semiconductor layer 104), adrain electrode 106 and a gate electrode GE (e.g. a part of the scanline SL). The gate electrode GE is connected to the scan line SL, andthe gate electrode GE may extend along the Y direction and protrude fromthe scan line SL, the source electrode SE, the drain electrode 106 andthe gate electrode GE all may at least partially overlap with thesemiconductor layer 104.

As shown in FIG. 3, in some embodiments, the scan line SL and/or thegate electrode GE are disposed on the first substrate 100, and a firstdielectric layer 120 is disposed (or covered) on the scan line SL and/orthe gate electrode GE. The semiconductor layer 104 is disposed on thefirst dielectric layer 120, the drain electrode 106, the sourceelectrode SE, and/or the data line DL are disposed on the firstdielectric layer 120. In addition, in a normal direction (e.g., the Zdirection) of the first substrate 100, the drain electrode 106 and thesource electrode SE partially overlap with the semiconductor layer 104and the scanning line SL (e.g., the gate electrode GE). In someembodiments, a second dielectric layer 122 is disposed on the firstdielectric layer 120, and is disposed or covered on the semiconductorlayer 104, the drain electrode 106, the source electrode SE, and/or thedata line DL. In some embodiments, a planarization layer 110 is disposedon the second dielectric layer 122, and the planarization layer 110 maybe disposed on the scan line SL, the data line DL, the semiconductorlayer 104, and/or the drain electrode 106. In other words, theplanarization layer 110 may cover the transistor 100T. In someembodiments, the first dielectric layer 120 and/or the second dielectriclayer 122 may serve as an inter-layer dielectric (ILD). In someembodiments, the material of the first dielectric layer 120 and/or thesecond dielectric layer 122 may include, but is not limited to, siliconnitride, silicon oxide, silicon oxynitride, aluminum oxide, othersuitable materials or a combination thereof. In some embodiments, theplanarization layer 110 may include, but is not limited to, organicmaterials, inorganic materials, other suitable materials, or acombination thereof. For example, the inorganic material may includesilicon nitride, silicon oxide, silicon oxynitride, aluminum oxide,other suitable materials or a combination thereof, but it is not limitedthereto. For example, the organic material may include epoxy resins,silicone resins, acrylic resins (such as polymethylmetacrylate (PMMA)),polyimide, perfluoroalkoxy alkane (PFA), other suitable materials or acombination thereof, but it is not limited thereto.

Referring to FIG. 1 and FIG. 3 at the same time, in some embodiments,the second dielectric layer 122 has a plurality of first through holesV₁, and in a normal direction of the first substrate 100, these firstthrough holes V₁ overlap with at least a portion of the drain electrodes106. For example, the first through hole V₁ may penetrate the seconddielectric layer 122 and expose a portion of the drain electrode 106. Insome embodiments, the pixel unit of the electronic device 10 may includea pixel electrode 108. For example, the pixel electrode 108 may bedisposed on a portion of the second dielectric layer 122 and/or aportion of the planarization layer 110. The planarization layer 110 hasa plurality of second through holes V₂. In the Z direction, these secondthrough holes V₂ overlap with the first through holes V₁, and the pixelelectrode 108 may be electrically connected to the transistor 100T(e.g., the drain electrode 106) through the second through holes V₂and/or the first through holes V₁, but it is not limited thereto. Insome embodiments, the material of the pixel electrode 108 may include ametal conductive material, a transparent conductive material, othersuitable materials or a combination thereof, but it is not limitedthereto.

Referring to FIG. 3, in some embodiments, the first spacer 102 may bedisposed on the planarization layer 110. In some embodiments, athickness T1 of the first spacer 102 may be less than or equal to athickness T2 of the planarization layer 110. The thickness T1 may bedefined by a maximum thickness of the first spacer 102 in the Zdirection in a cross-sectional image, and the thickness T2 may bedefined by a maximum thickness of the planarization layer 110 in the Zdirection in a cross-sectional image. In some embodiments, the firstspacer 102 is disposed on the planarization layer 110, and the firstspacer 102 is not disposed in the first through hole V₁ and/or thesecond through hole V₂, the first spacer 102 has a more planar structureto reduce the slippage of the second spacer 202 when an external forceis applied thereto.

Referring to FIG. 1 and FIG. 3, in some embodiments, the first spacer102 may be located between two adjacent first through holes V₁. In someembodiments, in a normal direction (e.g., the Z direction) of the firstsubstrate 100, the first through hole V₁ does not overlap with the firstspacer 102. In some embodiments, the first spacer 102 may be locatedbetween two adjacent second through holes V₂. In some embodiments, inthe normal direction of the first substrate 100, the second via hole V₂does not overlap with the first spacer 102. In some embodiments, adistance G₁ between the first spacer 102 and the first through hole V₁may be greater than or equal to 5 micrometers (μm) (distance G₁≥5micrometers), but it is not limited thereto. The distance G₁ may bedefined by a minimum distance between the first spacer 102 and the firstthrough hole V₁ in the X direction. In some embodiments, the distance G₁may be greater than or equal to 6 micrometers (μm) (distance G₁≥6micrometers), and the distance G₁ may be greater than or equal to 6.5micrometers, 7 micrometers, or 7.5 micrometers. In some embodiments, thedistance G₁ may be greater than or equal to 0.5 times a width W₁ of thefirst spacer 102 (distance G₁≥0.5*width W₁), but it is not limitedthereto. In some embodiments, the distance G1 may be greater than orequal to 0.55 times the width W1 of the first spacer 102 (distanceG1≥0.55*width W1). In some embodiments, the distance G₁ may be, forexample, greater than or equal to 0.6 times, 0.7 times, or 0.8 times thewidth W₁ of the first spacer 102. In some embodiments, the distance G₁may be less than 2.5 times the width W₁ of the first spacer 102(distance G₁<2.5*width W₁). The width W₁ may be defined by a maximumwidth of the first spacer 102 in a direction (for example, X direction)perpendicular to an extending direction E₁₀₂ of the first spacer 102. Itshould be understood that, the “extending direction” of an object refersto a direction along or substantially parallel to the long axis of theobject. For example, the object can be encircled by a minimum rectangle,and the extending direction of the long side of the minimum rectangle isthe direction of the long axis. In addition, the distance G₁ and thewidth W₁ can be measured in an image (for example an optical microscopeimage). For example, the width W₁ is obtained from measuring a maximumwidth between outer edges of the first spacer 102 in the directionperpendicular to the extending direction E₁₀₂. For example, the distanceG₁ is obtained from measuring a minimum distance between the outer edgeof the first spacer 102 and the inner edge of the first through hole V₁in the direction perpendicular to the extending direction E₁₀₂.

It should be understood that although both the minimum distances betweenthe first spacer 102 and the two adjacent first through holes V₁ in thedrawing are denoted as G₁, in accordance with some other embodiments,the distances G1 between the first spacer 102 and the two adjacent firstthrough holes V₁ may be the same or different. As described above, asshown in FIG. 1 to FIG. 3, the first spacer 102 and/or the second spacer202 is disposed between the first substrate 100 and the second substrate200, and the first spacer 102 and/or the second spacer 202 can serve asspacing elements. In some embodiments, the extending direction E₁₀₂ ofthe first spacer 102 is substantially the same as an extending directionE₁ of the data line DL, but it is not limited thereto. In someembodiments (not illustrated), an included angle θ1 between theextending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₁ of the data line DL may be between about 5 degrees andabout 40 degrees (5 degrees included angle θ1≤40 degrees), but it is notlimited thereto. In some embodiments, in the normal direction of thefirst substrate 100, the first spacer 102 may overlap with the data lineDL, and the above-mentioned “overlap with” means that the two at leastpartially overlap. Under the above design, the length of the firstspacer 102 can be appropriately extended to increase the buffer space,and the first spacer 102 does not significantly occupy the aperture areaof the pixel unit. Similarly, in some embodiments, the second spacer 202may extend along an extending direction E₂₀₂. In some embodiments (asshown in FIG. 4), the extending direction E₁₀₂ of the first spacer 102is different from the extending direction E₂₀₂ of the second spacer 202.In some embodiments (as shown in FIG. 4), the included angle θ betweenthe extending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₂₀₂ of the second spacer 202 may be between about 45 degreesand about 90 degrees (45 degrees≤included angle θ≤90 degrees), but it isnot limited thereto. In some embodiments, the included angle θ betweenthe extending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₂₀₂ of the second spacer 202 may be between about 60 degreesand about 90 degrees (60 degrees≤included angle θ≤90 degrees). In someembodiments, the included angle θ between the extending direction E₁₀₂of the first spacer 102 and the extending direction E₂₀₂ of the secondspacer 202 may be between about 80 degrees and about 90 degrees (80degrees≤included angle θ≤90 degrees).

In some embodiments, the material of the first spacer 102 and/or thesecond spacer 202 may include, but is not limited to, organic materials,inorganic materials, or a combination thereof. For example, the organicmaterial may include epoxy resin, acrylic resin such aspolymethylmetacrylate (PMMA), benzocyclobutene (BCB), polyethyleneterephthalate (PET), polyethylene (PE), polyethersulfone (PES),polycarbonate (PC), other suitable materials or a combination thereof.In some embodiments, the material of the second spacer 202 may be thesame as or different from the material of the first spacer 102. As shownin FIG. 2, in some embodiments, the second substrate 200 can be used asa color filter substrate, but it is not limited thereto. In someembodiments, the electronic device 10 may include a light-shieldinglayer 204 and/or a color filter layer 206 disposed on the secondsubstrate 200, and the second spacer 202 may be disposed on thelight-shielding layer 204. In addition, in the normal direction of thefirst substrate 100, the light-shielding layer 204 may overlap with orcover the second spacer 202. In some embodiments, the light-shieldinglayer 204 may include a black matrix, and the light-shielding layer 204may have a plurality of openings OP. In addition, in the normaldirection of the first substrate 100, the color filter layer 206 mayoverlap with the openings OP of the light-shielding layer 204. In someembodiments, the material of the light-shielding layer 204 may include,but is not limited to, black photoresist, black printing ink, blackresin, metal, carbon black material, resin material, photosensitivematerial, other suitable materials or a combination thereof. In someembodiments, the color filter layer 206 may include a plurality of colorfilter units FU. For example, the color filter units FU may include redfilter units, green filter units and/or blue filter units, but they arenot limited thereto. In accordance with different embodiments, the colorfilter layer 206 may have a suitable number or color filter units FU ofa suitable color.

Next, refer to FIG. 4, which is a schematic top-view diagram of theelectronic device 10 in accordance with some embodiments of the presentdisclosure. In detail, FIG. 4 includes the first substrate 100 and thesecond substrate 200, and FIG. 4 may be an overlay diagram of the firstsubstrate 100 shown in FIG. 1 (including elements disposed on the firstsubstrate 100) and the second substrate 200 shown in FIG. 2 (includingelements disposed on the second substrate 200). It should be understoodthat, in order to clearly describe the characteristics of specificelements, some elements of the electronic device 10 are omitted in thedrawing, and the dashed line and solid line illustrated in the drawingmay not represent the up-down relationship of the elements. In addition,the same or similar components (or elements) in the following paragraphwill be denoted by the same or similar reference numbers, and theirmaterials, manufacturing methods and functions are the same or similarto those described above, and thus they will not be repeated in thefollowing context.

As shown in FIG. 1 to FIG. 4, in some embodiments, the first spacer 102and/or the second spacer 202 have an elongated structure, and the firstspacer 102 and the second spacer 202 intersect (cross) with each otherto form a cross-shaped or an X-shaped, but it is not limited thereto. Insome embodiments, part of the first spacer 102 does not overlap with thesecond spacer 202. Specifically, the first spacer 102 includes a firstportion 102 a, a second portion 102 b, and a third portion 102 c. Thefirst portion 102 a overlaps with the second spacer 202 in the normaldirection (e.g., the Z direction) of the first substrate 100. The secondportion 102 b and the third portion 102 c are respectively adjacent tothe first portion 102 a, and the first portion 102 a connects betweenthe second portion 102 b and the third portion 102 c. Furthermore, insome embodiments, the first portion 102 a has a first length B₁, thesecond portion 102 b has a second length D_(a), the third portion 102 chas a third length D_(b). In addition, the second length D_(a) isgreater than or equal to the first length B₁ (the second lengthD_(a)≥the first length B₁), and the third length D_(b) is greater thanor equal to the first length B₁ (the third length D_(b)≥the first lengthB₁).

It should be noted that, the second portion 102 b and/or the thirdportion 102 c can serve as a shifting buffer region for the secondspacer 202. The second portion 102 b and/or the third portion 102 c canreduce the probability of the second spacer 202 shifting to an areaoutside the first spacer 102 when an external force is applied to thepanel, or reduce the probability of the layer (e.g., alignment layer,not illustrated) disposed on the first substrate 100 being scratched bythe second spacer 202.

In some embodiments, the second length D_(a) is greater than or equal to10 micrometers (second length D_(a)≥10 micrometers), or greater than orequal to 12 micrometers, 14 micrometers, 16 micrometers, or 18micrometers, but it is not limited thereto. In some embodiments, thethird length D_(b) is greater than or equal to 10 micrometers (thirdlength D_(b)≥10 micrometers), or greater than or equal to 11micrometers, 13 micrometers, 15 micrometers, or 17 micrometers, but itis not limited thereto.

In some embodiments, the ratio of the second length D_(a) of the secondportion 102 b to the first length B₁ of the first portion 102 a isgreater than or equal to 1.4 (second length D_(a)/first length B₁≥1.4),or greater than or equal to 1.6, 1.8 or 2, but it is not limitedthereto. In some embodiments, the ratio of the third length D_(b) of thethird portion 102 c to the first length B₁ of the first portion 102 a isgreater than or equal to 1.4 (third length D_(b)/first length B₁≥1.4),or greater than or equal to 1.5, 1.7 or 1.9, but it is not limitedthereto.

In some embodiments, the ratio of the third length D_(b) to the secondlength D_(a) is between 0.6 and 1.7 (0.6≤third length D_(b)/secondlength D_(a)≤1.7), or between 0.8 and 1.5 (0.8≤third length D_(b)/secondlength D_(a)≤1.5), for example, may be 0.9, 1, 1.1, 1.2, 1.3 or 1.4, butit is not limited thereto.

It should be noted that, the aforementioned first length B₁, secondlength D_(a), and third length D_(b) are measured along a reference lineon the same image (e.g., OM image). The reference line may be a lineextending in any direction paralleled to the surface of the firstsubstrate 100 (for example, the XY plane in the drawing), as long as thefirst length B₁, the second length D_(a) and the third length D_(b) meetthe above-mentioned relationships that the second length D_(a) isgreater than or equal to the first length B₁, and the third length D_(b)is greater than or equal to the first length B₁. In accordance with someembodiments, the extending direction E₁₀₂ of the first spacer 102 can beused as a reference line. In other words, the aforementioned firstlength B₁, second length D_(a) and third length D_(b) can be measuredalong the extending direction E₁₀₂ of the first spacer 102, but it isnot limited thereto.

In some embodiments, the first spacer 102 has a length L₁ in theextending direction E₁₀₂, and the length L₁ is the sum of the firstlength B₁, the second length D_(a), and the third length D_(b) in theextending direction E₁₀₂. In some embodiments, the ratio of the lengthL₁ of the first spacer 102 to the width W₁ of the first spacer 102 isgreater than or equal to 3 (length L₁/width W₁≥3), or greater than orequal to 3.5, 4, or 4.5, but it is not limited thereto. In someembodiments, the ratio of the length L₁ of the first spacer 102 to thefirst length B₁ of the first portion 102 a is between 3 and 8 (3≤lengthL₁/first length B₁≤8), or between 4 and 7 and 4 (4≤length L₁/firstlength B₁≤7). For example, 5 or 6, but it is not limited thereto.

According to the foregoing, in accordance with some embodiments, thefirst spacer 102 is designed to have a specific size, which can enhancethe buffering effect for shifting or reduce the probability of the layer(e.g., alignment layer, not illustrated) on the second substrate 200being scratched by the first spacer 102.

As shown in FIG. 4, in some embodiments, in the normal direction (e.g.,the Z direction) of the first substrate 100, the light-shielding layer204 overlaps with the first spacer 102, and the color filter layer 206does not overlap with the first spacer 102. In some embodiments, thelight-shielding layer 204 may cover the first spacer 102, the secondspacer 202, the data line DL and/or the scan line SL. Theabove-mentioned “cover” means that the first spacer 102, the secondspacer 202, the data line DL and/or the scan line SL can be covered bythe light-shielding layer 204 when they are viewed in the normaldirection of the first substrate 100. However, the first spacer 102, thesecond spacer 202, the data line DL and/or the scan line SL may beformed on the same or different substrates as the light-shielding layer204. In some embodiments, in the normal direction of the first substrate100, the first spacer 102 may overlap with the data line DL and/or thescan line SL. In some embodiments, the position where the first spacer102 overlaps with the second spacer 202 (i.e. the first portion 102 a)may overlap with an intersecting region of the data line DL and the scanline SL, but it is not limited thereto.

Refer to FIG. 5, which is a schematic top-view diagram of the electronicdevice 10 in accordance with some embodiments of the present disclosure.Specifically, FIG. 5 is similar to FIG. 4, but the features aredifferent. It should be understood that, in order to clearly describethe characteristics of specific elements, some elements of theelectronic device 10 are omitted in the drawing, and the dashed line andsolid line illustrated in the drawing may not represent the up-downrelationship of the elements. As shown in FIG. 5, in some embodiments,part of the second spacer 202 does not overlap with the first spacer102. In detail, the second spacer 202 may include a fourth portion 202a, a fifth portion 202 b, and a sixth portion 202 c. The fourth portion202 a overlaps with the first spacer 102 in the normal direction (e.g.,the Z direction) of the first substrate 100, the fifth portion 202 b andthe sixth portion 202 c are adjacent to the fourth portion 202 a, andthe fourth portion 202 a connects between the fifth portion 202 b andthe sixth portion 202 c. In some embodiments, the fourth portion 202 ahas a fourth length B₂, the fifth portion 202 b has a fifth lengthD_(c), and the sixth portion 202 c has a sixth length D_(d). Inaddition, the fifth length D_(c) is greater than or equal to the fourthlength B₂ (fifth length D_(c)≥fourth length B₂), and the sixth lengthD_(d) is greater than or equal to the fourth length B₂ (sixth lengthD_(d)≥fourth length B₂).

It should be noted that, the fifth portion 202 b and the sixth portion202 c of the second spacer 202 can serve as a shifting buffer region forthe first spacer 102. The fifth portion 202 b and the sixth portion 202c can reduce the probability of the first spacer 102 shifting to an areaoutside the second spacer 202 when an external force is applied to thepanel, or reduce the probability of the layer (e.g., alignment layer,not illustrated) disposed on the second spacer 202 being scratched bythe first spacer 102.

In some embodiments, the fifth portion 202 b has a fifth length D_(c)greater than or equal to 10 micrometers (fifth length D_(c)≥10micrometers), or greater than or equal to 12 micrometers, 14micrometers, 16 micrometers or 18 micrometers, but it is not limitedthereto. In some embodiments, a sixth length D_(d) of the sixth portion202 c is greater than or equal to 10 micrometers (sixth length D_(d)≥10micrometers), or greater than or equal to 11 micrometers, 13micrometers, 15 micrometers, or 17 micrometers, but it is not limitedthereto.

In some embodiments, the ratio of the fifth length D_(c) to the fourthlength B₂ is greater than or equal to 1.4 (fifth length D_(c)/fourthlength B₂≥1.4), or greater than or equal to 1.5, 1.6, 1.7 or 1.8, but itis not limited thereto. In some embodiments, the ratio of the sixthlength D_(d) to the fourth length B₂ is greater than or equal to 1.4(sixth length D_(d)/fourth length B₂≥1.4), or greater than or equal to1.5, 1.6, 1.7 or 1.8, but it is not limited thereto.

In some embodiments, the ratio of the fifth length D_(c) of the fifthportion 202 b to the sixth length D_(d) of the sixth portion 202 c isbetween 0.6 and 1.7 (0.6≤fifth length D_(c)/sixth length D_(d)≤1.7) orbetween 0.8 and 1.5 (0.8≤fifth length D_(c)/sixth length D_(d)≤1.5), forexample, 0.9, 1, 1.1, 1.2, 1.3 or 1.4, but it is not limited thereto. Itshould be noted that, the aforementioned fourth length B₂, fifth lengthD_(c), and sixth length D_(d) are measured along a reference line on thesame image (e.g., OM image). The reference line may be a line extendingin any direction paralleled to the surface of the first substrate 100(for example, the XY plane in the drawing) as long as the fourth lengthB₂, fifth length D_(c) and sixth length D_(d) meet the above-mentionedrelationships that the fifth length D_(c) is greater than or equal tothe fourth length B₂, and the sixth length D_(d) is greater than orequal to the fourth length B₂. In accordance with some embodiments, theextending direction E₂₀₂ of the second spacer 202 can be used as thereference line. In other words, the aforementioned fourth length B₂,fifth length D_(c), and sixth length D_(d) can be measured along theextending direction E₂₀₂ of the second spacer 202, but it is not limitedthereto.

In some embodiments, the second spacer 202 has a length L₂ in theextending direction E₂₀₂, and the length L₂ is the sum of the fourthlength B₂, the fifth length D_(c), and the sixth length D_(d) in theextending direction E₂₀₂. In some embodiments, the ratio of the lengthL₂ of the second spacer 202 to a width W₂ of the second spacer 202 isgreater than or equal to 3 (length L₂/width W₂≥3), or greater than orequal to 3.5, 4, or 4.5, but it is not limited thereto. In someembodiments, the ratio of the length L₂ of the second spacer 202 to thefourth length B₂ of the fourth portion 202 a is between 3 and 8(3<length L₂/fourth length B₂<8) or between 4 and 7 (4<length L₂/fourthlength B₂<7), for example, 5 or 6, but it is not limited thereto.

According to the foregoing, in accordance with some embodiments, thesecond spacer 202 is designed to have a specific size, which can enhancethe buffering effect for shifting or reduce the probability of the layer(e.g., alignment layer, not illustrated) disposed on the first substrate100 being scratched by the second spacer 202.

As shown in FIG. 5, in some embodiments, the extending direction E₂₀₂ ofthe second spacer 202 is different from the extending direction E₁₀₂ ofthe first spacer 102. In some embodiments, the included angle betweenthe extending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₂₀₂ of the second spacer 202 may be between about 45 degreesand about 90 degrees (45 degrees≤included angle≤90 degrees), but it isnot limited thereto. In some embodiments, the included angle between theextending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₂₀₂ of the second spacer 202 may be between about 60 degreesand about 90 degrees (60 degrees≤included angle≤90 degrees), but it isnot limited thereto. In some embodiments, the included angle between theextending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₂₀₂ of the second spacer 202 may be between about 80 degreesand about 90 degrees (80 degrees≤included angle≤90 degrees). In someembodiments, the extending direction E₂₀₂ of the second spacer 202 issubstantially the same as an extending direction E₂ of the scan line SL.In some embodiments, in the normal direction of the first substrate 100,the second spacer 202 may overlap with the data line DL and/or the scanline SL, and the above-mentioned “overlap with” means that the two atleast partially overlap. In this way, the length of the second spacer202 can be appropriately extended to increase the buffer space, and thesecond spacer 202 does not significantly occupy the aperture area of thepixel unit. In some embodiments, the position where the second spacer202 overlaps with the first spacer 102 (i.e. the fourth portion 202 a)may overlap with an intersecting region of the data line DL and the scanline SL, but it is not limited thereto.

Refer to FIG. 6, which is a schematic cross-sectional diagram of theelectronic device 10 in accordance with some embodiments of the presentdisclosure. The cross-sectional structure shown in FIG. 6 may correspondto the section line A-A′ in FIG. 4. It should be understood that, someelements of the electronic device 10 are omitted in the drawing forclarity. As shown in FIG. 6, the first spacer 102 and the second spacer202 are disposed between the first substrate 100 and the secondsubstrate 200, the first spacer 102 and the second spacer 202 interlacewith each other. In some embodiments, the planarization layer 110 isdisposed between the first spacer 102 and the first substrate 100. Insome embodiments, a planarization layer 210 is disposed between thesecond spacer 202 and the second substrate 200. In some embodiments, theplanarization layer 110 may provide a planar surface for disposing thefirst spacer 102, or improving the structural flatness of the firstspacer 102. In some embodiments, the planarization layer 210 may providea planar surface for disposing the second spacer 202, or improving thestructural flatness of the second spacer 202. In some embodiments, theplanarization layer 210 may be disposed between the second spacer 202and the light-shielding layer 204. It should be noted that, if thestructure of the first spacer 102 is not flat (or planar), the oppositespacer (for example, the second spacer 202) may be easily shifted (ordisplaced) due to an external force, affecting other layers (forexample, a first alignment layer AL₁, but it is not limited thereto)disposed on the first substrate 100. It should be noted that, if thestructure of the second spacer 202 is not flat, the opposite spacer (forexample, the first spacer 102) may be easily displaced due to anexternal force, affecting other layers disposed on the second substrate200 (for example, a second alignment layer AL₂, but it is not limitedthereto). Furthermore, the material of the planarization layer 210 maybe similar to the material of the planarization layer 110, and will notbe repeated herein. Furthermore, the material of the planarization layer210 may be the same as or different from the material of theplanarization layer 110. In some other embodiments (not illustrated),the planarization layer 110 or the planarization layer 210 can beremoved.

In some embodiments, the first alignment layer AL₁ may be disposed onthe first spacer 102 and a portion of the planarization layer 110, andthe second alignment layer AL₂ may be disposed on the second spacer 202and a portion of the planarization layer 210. In some embodiments, adielectric layer (such as a liquid-crystal layer or other dielectriclayers, not illustrated) may be disposed between the first alignmentlayer AL₁ and the second alignment layer AL₂. In some embodiments (notillustrated), the thickness of the first alignment layer AL₁corresponding to (or disposing on) the first spacer 102 is smaller thanthe thickness of the first alignment layer AL₁ corresponding to (ordisposing on) the planarization layer 110. In some embodiments (notillustrated), the thickness of the second alignment layer AL₂corresponding to (or disposing on) the second spacer 202 is smaller thanthe thickness of the second alignment layer AL₂ corresponding to (ordisposing on) the planarization layer 210. In some embodiments, in thecross section, the first spacer 102 and/or the second spacer 202 mayhave curved edges, but it is not limited thereto.

Refer to FIG. 7 and FIG. 8, which are schematic top-view diagrams of thefirst spacer 102 and the second spacer 202 of the electronic device inaccordance with some embodiments of the present disclosure. As shown inFIG. 7, in some embodiments, the first spacer 102 may have an elongatedstructure, and the second spacer 202 may have a circle shape structure(such as cylindrical structure), but it is not limited thereto. As shownin FIG. 8, in some embodiments, the first spacer 102 may have a circleshape structure (such as cylindrical structure), and the second spacer202 may have an elongated structure, but it is not limited thereto. Inthe embodiments shown in FIG. 7 and FIG. 8, the first spacer 102 haspart that does not overlap with the second spacer 202, and the secondspacer 202 also has part that does not overlap with the first spacer102. As described above, these parts (or portions) can serve as shiftingbuffer regions for the first spacer 102 and/or the second spacer 202.

It should be understood that, in accordance with the embodiments of thepresent disclosure, the shapes of the first spacer 102 and the secondspacer 202 are not limited to those depicted in FIG. 7 and FIG. 8. Inaccordance with some embodiments, the first spacer 102 and the secondspacer 202 can have any other suitable shapes (such as rectangular,polygonal, or arc-shaped, but it is not limited thereto) according toneeds, as long as the shape of the first spacer 102 can meet theaforementioned relationships that the second length D_(a) is greaterthan or equal to the first length B₁, and the third length D_(b) isgreater than or equal to the first length B₁ or the shape of the secondspacer 202 can meet the aforementioned relationships that the fifthlength D_(c) is greater than or equal to the fourth length B₂, and thesixth length D_(d) is greater than or equal to the fourth length B₂.

Refer to FIG. 9, which is a schematic top-view diagram of the firstspacer 102, the second spacer 202, the data line DL, and the firstthrough holes V₁ of the electronic device in accordance with someembodiments of the present disclosure. As shown in FIG. 9, in someembodiments, the included angle between the extending direction E₁₀₂ ofthe first spacer 102 and the extending direction E₂₀₂ of the secondspacer 202 is between 45 degrees and 90 degrees (45 degrees≤includedangle θ≤90 degrees), or between 60 degrees to 90 degrees (60degrees≤included angle θ≤90 degrees), or between 80 degrees to 90degrees (80 degrees≤included angle θ≤90 degrees), but it is not limitedthereto. In some embodiments, the included angle θ1 between theextending direction E₁₀₂ of the first spacer 102 and the extendingdirection E₁ of the data line DL is between 0 degree and 45 degrees (0degree≤included angle θ1≤45 degrees), or between 10 degrees and 45degrees (10 degrees≤included angle θ1≤45 degrees), or between 10 degreesand 30 degrees (10 degrees≤included angle θ1≤30 degrees), but it is notlimited thereto. In some embodiments, the overlapping area of the firstspacer 102 and the second spacer 202 is substantially between twoadjacent first through holes V₁, and the overlapping area of the firstspacer 102 and second spacer 202 is substantially located on aconnecting line of two adjacent first through holes V₁, and theconnecting line may be substantially parallel to the X direction, but itis not limited thereto.

In accordance with the embodiments of the present disclosure, an opticalmicroscopy (OM), a scanning electron microscope (SEM), a film thicknessprofiler (u-step), an ellipsometer or another suitable methods may beused to measure the width, length, thickness of each element or thedistance between elements. Specifically, in some embodiments, a scanningelectron microscope can be used to obtain any cross-sectional imageincluding the elements to be measured, and the width, length, thicknessor distance between the elements in the image can be measured.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. The features of the various embodiments can be used inany combination as long as they do not depart from the spirit and scopeof the present disclosure. Moreover, the scope of the presentapplication is not intended to be limited to the particular embodimentsof the process, machine, manufacture, composition of matter, means,methods and steps described in the specification. As one of ordinaryskill in the art will readily appreciate from the present disclosure,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods or steps.In addition, each claim constitutes an individual embodiment, and theclaimed scope of the present disclosure includes the combinations of theclaims and embodiments. The scope of protection of present disclosure issubject to the definition of the scope of the appended claims. Anyembodiment or claim of the present disclosure does not need to meet allthe purposes, advantages, and features disclosed in the presentdisclosure.

1. An electronic device, comprising: a first substrate; a secondsubstrate disposed opposite to the first substrate; a scan line disposedon the first substrate; a transistor disposed on the first substrate andhaving a gate electrode connected to the scan line and protruding fromthe scan line; a first spacer disposed on the first substrate; and asecond spacer disposed on the second substrate and between the firstspacer and the second substrate, part of the first spacer not overlappedwith the second spacer, and the first spacer comprising: a first portionoverlapped with the second spacer in a normal direction of the firstsubstrate; a second portion; and a third portion, and the first portionconnecting between the second portion and the third portion; wherein thefirst portion has a first length, the second portion has a secondlength, the third portion has a third length, the second length isgreater than or equal to the first length, and the third length isgreater than or equal to the first length, and the first portionoverlaps with the gate electrode.
 2. The electronic device as claimed inclaim 1, wherein the second spacer comprises: a fourth portionoverlapped with the first spacer in the normal direction of the firstsubstrate; a fifth portion; and a sixth portion, and the fourth portionconnecting between the fifth portion and the sixth portion; wherein thefourth portion has a fourth length, the fifth portion has a fifthlength, the sixth portion has a sixth length, the fifth length isgreater than or equal to the fourth length, and the sixth length isgreater than or equal to the fourth length.
 3. The electronic device asclaimed in claim 1, further comprising: a planarization layer disposedbetween the first spacer and the first substrate.
 4. The electronicdevice as claimed in claim 1, further comprising: a planarization layerdisposed between the second spacer and the second substrate.
 5. Theelectronic device as claimed in claim 1, wherein the second length isgreater than or equal to 10 micrometers, or the third length is greaterthan or equal to 10 micrometers.
 6. The electronic device as claimed inclaim 1, wherein a ratio of the second length to the first length isgreater than or equal to 1.4, or a ratio of the third length to thefirst length is greater than or equal to 1.4.
 7. The electronic deviceas claimed in claim 2, wherein a ratio of the fifth length to the fourthlength is greater than or equal to 1.4, or a ratio of the sixth lengthto the fourth length is greater than or equal to 1.4.
 8. The electronicdevice as claimed in claim 1, wherein a ratio of a length of the firstspacer to a width of the first spacer is greater than or equal to
 3. 9.The electronic device as claimed in claim 1, wherein an extendingdirection of the first spacer is different from an extending directionof the second spacer.
 10. The electronic device as claimed in claim 1,further comprising: a data line disposed on the first substrate, whereinan extending direction of the first spacer is the same as an extendingdirection of the data line.
 11. The electronic device as claimed inclaim 10, wherein an extending direction of the second spacer is thesame as an extending direction of the scan line.
 12. The electronicdevice as claimed in claim 11, wherein the first portion overlaps withan intersecting region of the data line and the scan line.
 13. Theelectronic device as claimed in claim 1, wherein the first spacer andthe second spacer intersect with each other to form a cross-shaped or anX-shaped.
 14. The electronic device as claimed in claim 1, wherein aratio of the third length to the second length is between 0.6 and 1.7.15. The electronic device as claimed in claim 2, wherein a ratio of thefifth length to the sixth length is between 0.6 and 1.7.
 16. Theelectronic device as claimed in claim 2, wherein the fifth length isgreater than or equal to 10 micrometers, or the sixth length is greaterthan or equal to 10 micrometers.
 17. The electronic device as claimed inclaim 1, wherein a ratio of a length of the second spacer to a width ofthe second spacer is greater than or equal to
 3. 18. The electronicdevice as claimed in claim 9, wherein an included angle between theextending direction of the first spacer and the extending direction ofthe second spacer is between 45 degrees and 90 degrees.
 19. Theelectronic device as claimed in claim 1, further comprising: alight-shielding layer disposed on the second substrate, wherein thelight-shielding layer overlaps with the second spacer.
 20. Theelectronic device as claimed in claim 1, further comprising: a firstalignment layer disposed on the first spacer; and a second alignmentlayer disposed on the second spacer